Automated Optical Inspection／wafer surface inspection system／YGK Corporation

New designed compact and high performance of wafer surface inspection system is reduced 50% to its footprint compared with previous same kind of product.  Despite compact body, the maximum sensitivity is 0.15um on bare silicon, and then it can be easy to move to your designated location with desk.
Can choose the surface isolated function (The function can measure a surface of the transparent wafer without receiving contaminations of a back wafer.) as optional for transparent substrate and wafer. Output is map, histogram, which are saved and displayed to an attached PC.

Specifications

Workpiece size

Maximum２００×２００ｍｍ、φ２００ｍｍ
(Apply to measure 300mm※１)

Maximum sensitivity
(Bare Si PSL)

Si wafer   Transparent substrate
(Require optional selection)

Scanning method

XY or Rotation scanning

Workpiece load

Manual

Dimension

Ｗ５４８×Ｄ５７２×Ｈ９６２(ｍｍ)　PC is separate placement

Weight

９０ｋｇ(PC is separate placement)

Power supply

ＡＣ１００Ｖ　１５Ａ

　　　　　　　　　　　　　　　　　　 ※１　300mm handling changes a depth dimension.