Tape frame wafer surface particle scanner
YPI-MX TF FOUP
Laser inspection system for unpatterned dicing wafer with tape frame.
For develop & pilot process lines.
Spec
Model | YPI-MX TF FOUP |
---|---|
Loading type | Auto loading |
Dimension | (W)2330 x (D)1400 x (H)1820mm (1 FOUP) |
(W)2520 x (D)1807 x (H)2007mm (Dual FOUP) | |
Utility (Power) | AC200V |
Utility (Vacuum) | -70kPa -60kPa -40kPa |
Utility (Compressed air) | 0.6MPa |
Wafer type | Tape frame wafer & Wafers |
Wafer size | 12inch tape frame wafer |