Automated Optical Inspection／wafer surface inspection system／YGK Corporation

ＹＰＩ−N−ＸＹ／ＹＰＩ−N−Θ
Wafer surface inspection system YPI-N series（Manual）
Can scan particles on mirror wafer (silicon wafer) with fast.
Wide range measurement from small size wafer (2/3inch) to 8inch wafer.

Specifications

Work piece size

Maximum２００ｍｍ×２００ｍｍ
（Contact us if you want to handle more than 200mm）

Scanning method

XY scanning or Rotation scanning

Inspection time

Square shape of 200mm is approx. 4min／Wafer shape of 200mm is approx. 3min

Work piece setting

Manual

Dimension

Ｗ９００ｍｍ×Ｄ１,０００ｍｍ×Ｈ１,７５７ｍｍ

Weight

Approx.５００ｋｇ

Power Consumption

Approx.１.５ｋＷ（１００Ｖ）

Target substrate

Silicon wafer, Filmed wafer

Maximum sensitivity

0.1um on Bare silicon