Automated Optical Inspection／wafer surface inspection system／YGK Corporation

ＹＰＩ－ＭＸ－ＸＹＡ／ＹＰＩ－ＭＸ－ΘＡ
Glass substrate/ Sapphire wafer surface inspection system.
YPI-MX series（Auto loading type）
Specialized to tune for a transparent substrate.  Apply to measure a rough polishing of back of substrate.

Specifications

Work piece size

Maximum ２００ｍｍ×２００ｍｍ
（Contact us if you want to handle more than 200mm）

Scanning method

XY scanning or Rotation scanning

Inspection time

□２００ｍｍ（Ｘ－Ｙ）Approx. 4min
Φ２００ｍｍ（Θ）　　 Within 2min
Φ１５０ｍｍ（Θ）　　 Within 1min 30sec
Φ１００ｍｍ（Θ）　　 Within 1min

Work piece setting

Robot transfer (Back or edge sucking by vacuum)

Dimension

Ｗ１,５３０ｍｍ×Ｄ１,３００ｍｍ×Ｈ１,９０３ｍｍ

Weight

Approx. １,０００ｋｇ

Power Consumption

Approx. ２.０ｋＷ（１００Ｖ）

Target substrate

Silicon wafer, Transparent substrate, Sapphire substrate,
LT wafer, SiC wafer, etc

Maximum sensitivity

Transparent substrate　　０.２μｍ
Silicon wafer　　　　　　　０.１μｍ